Q²M Compound+

Superb maintenance products for outstanding detailing performance

Q²M Compound+ is a heavy cutting paste that delivers an improved level of scratch removal and high abrasion with a low level of dust and limited secondary defects. Although it does leave light holograms, they are simple to remove with one pass of Q²M Polish.

AVAILABLE CAPACITIES: 120 ML / 1000 ML

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ADVICE ON APPLICATION AND PRECAUTIONS

Advice on application and precautions

Work with a polishing machine of your choice (rotary, dual-action or orbital with forced rotation). Spread at low revs. Work until fully diminished at medium revs. Wipe off with an HQ microfiber cloth. Use a 1:1 dilution of IPA to remove the remaining product and inspect the effect. If needed, re-use.

Consumption: 15-40ML/PANEL

Cut:

Finish:

HIGH CUTTING POWER AND GLOSSY FINISH

Q²M Compound+ delivers increased cutting power without the usual price of enormous defects. The formula is water-based and contains high-quality Japanese abrasives that allow fast and easy removal of harsh defects. No silicone or fillers make the procedure of pre-coating preparation and polish removal much faster and easier.

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