COMPOUND+ REDEFINED - Gyeon Australia

Exterior / Preparation

Heavy cutting compound - improved

Q²M Compound+ Redefined is a heavy cutting paste that delivers an improved level of scratch removal and high abrasion with almost no dust and limited secondary defects. Although it does leave light holograms, they are simple to remove with one pass of Q²M Polish.

Technical Details

A heavy cut compound with lots of power and low secondary defects.

Q²M Compound+ REDEFINED improves correction efficiency by combining high abrasion with controlled finishing behaviour. Its refined, water based formula supports faster work, clean residue removal and reliable preparation before further polishing or coating.

LOW DUST

NO SILICONES

NO FILLERS

TECHNICAL DETAILS

AVAILABLE CAPACITIES

120 ML / 250 ML / 1000 ML

Cut

Finish

Consumption

15-40ML/PANEL

HOW TO USE

Q ² M COMPOUND+ REDEFINED

Apply a small amount of Q²M Compound+ REDEFINED to a polishing pad.

Work the product using correct machine and pad combination.

Polish until defects are removed and the product is worked through.

Wipe off residue with a clean microfibre towel.

Follow with a finishing polish if required.

WATCH
Product
Video

FREQUENTLY ASKED
QUESTIONS

What type of defects is Q²M Compound+ REDEFINED designed for?

Severe scratches and heavy paint defects.

Does it produce a lot of dust?

No. It is formulated to keep dust levels low.

Will it leave holograms?

It may leave light holograms that are easy to remove.

Does it contain fillers or silicone?

No. It is filler free and silicone free.

Is it suitable before coating application?

Yes. It leaves a clean surface ready for further steps.

FIND MORE ANSWERS

Recommended Pairing

We recommend complementary products that perfectly match your current one, creating a complete and convenient KIT. Together, they deliver the best performance and a seamless user experience.